Compeq Manufacturing(Huizhou)CO.Ltd.

Business scope

Design, manufacture, and process precision circuit boards for large-scale integrated circuit packaging with line widths of 0.25 microns and below, and for large and medium-sized electronic computers, satellite communication systems, data communication multimedia systems, access network communication systems, etc. (high-density interconnect multi-layer printed circuit boards (HDI), multi-layer flexible boards (FPC), IC packaging substrates, special printed circuit boards (backplanes, high-frequency microwave boards, metal substrates and thick copper foil boards, embedded component boards, optoelectronic printed boards and nano-material printed boards)), flexible circuit boards, semiconductor packaging and its special materials, and sales of self-produced products. Products are sold in domestic and international markets. Engaged in the import and wholesale of similar products to those self-produced by the company, and the wholesale of domestically purchased products (excluding special products) (no physical stores, involving quota license management, special…