Compeq Technology(Huizhou)Co.,Ltd.

Business scope

Design, manufacture, processing, and sales of precision circuit boards (including high-density interconnect multilayer printed circuit boards (HDI), multilayer flexible boards (FPC), rigid-flex printed circuit boards (R-FPC), IC packaging carrier boards, special printed circuit boards (backplanes, high-frequency microwave boards, metal substrate and thick copper foil boards, embedded component boards, optoelectronic printed boards, and nano-material printed boards)) for large-scale integrated circuit packaging with line widths of 0.18 microns and below, and for large and medium-sized electronic calculators, satellite communication systems, data communication multimedia systems, access network communication systems, etc.; production, testing, and R&D of printed circuit board assembly for mobile communication equipment, electronic terminal products, computers and peripheral products, automotive electronic products, and medical instruments; sales of the company's products.